Chipmakers are moving from planar technology to an assortment of 3D-like architectures, such as 3D NAND and finFETs For these devices, chipmakers face a multitude of challenges in the fab. But one ...

Over the years, suppliers of metrology equipment have managed to meet the requirements for conventional planar chips. But tool vendors now find themselves behind in the emerging 3D chip era, prompting ...

Austin, Dec. 03, 2024 (GLOBE NEWSWIRE) -- Market Size & Growth Analysis: The SNS Insider report indicates that,“The 3D NAND Flash Memory Market Size was USD 17.59 billion in 2023 and is expected to ...

Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers of 3D NAND and ...

On Tuesday, Samsung Electronics Co (OTC:SSNLF) announced that it has started mass production of the world’s most advanced 286-layer NAND flash memory chips, which offer increased data storage capacity ...

Silicon has been with us for many decades but will need a replacement. For NAND storage, it has become increasingly difficult to progress by shrinking the process. The chief way to combat this is to ...

The main challenge in producing higher-capacity flash storage is one of scale -- as density goes up, so does cell interference and the chances of a breakdown. Samsung may have overcome that barrier ...

The part 1 of this two-article series outlined the NAND flash technology and how it transitioned from 2D to 3D NAND flash. The article also explained the current challenges in the way of density ...

Rob Crooke, the Vice President and General Manager of the NVM (Non-Volatile Memory) Solutions Group at Intel, announced the impending release of 3D NAND at Intel's Investor Meeting. Incidentally, the ...

SK Hynix and Toshiba have both experienced lower-than-expected yield rates for their 3D NAND technologies resulting in fewer supplies for Apple's 2017 series of iPhones, according to industry sources.