SANTA CLARA, Calif.–During the 2004 Symposium on VLSI Technology in Honolulu, Intel Corp. is expected to unveil a technology that could push out the need for chip-to-chip optical interconnects at ...
SANTA CLARA, Calif. — During the 2004 Symposium on VLSI Technology in Honolulu, Intel Corp. is expected to unveil a technology that could push out the need for chip-to-chip optical interconnects to at ...
Applied Materials rolled out a semiconductor fab tool this month that gives its a new way to engineer copper interconnects in advanced logic chips, solving a stumbling block to future 3-nanometer ...
Marvell's $3.8B acquisitions of Celestial AI and XConn target optical interconnects and CXL switching for next-gen AI ...
Ayar Labs Inc., a startup developing a new way of linking together chips in data centers, today announced that it has raised $25 million from investors. The funding was provided as an extension to a ...
New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...
The industry's first 90-nm test chip for X Architecture interconnect designs has been produced by Applied Materials (AMAT) at its Maydan Technology Center in Sunnyvale, Calif. The fabricated chip ...
It might not be what you would normally call a ‘smart’ material, but copper is certainly helping to pack more intelligence on to the average microchip. The material is now being used by IBM, soon to ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback