PORTLAND, Ore. — Microelectromechanical system (MEMS) chips are currently joined to separate CMOS ASICs after separate wafers are diced. A new technique called “chip-on-MEMS” bonds ASIC dice atop an ...
GRAZ, Austria, September 25, 2025--(BUSINESS WIRE)--USound, the technology leader in MEMS speakers and AI-based acoustic sensing solutions, and Gettop, a global provider of acoustic components, have ...
This is part of a NASA-supported project hoping to fabricate "device-ready" wafers from space-grown crystals. When you purchase through links on our site, we may earn an affiliate commission. Here’s ...
The UK is to get a MEMS multi-project wafer pipeline as the University of Southampton’s nascent Microcraft MEMS fab partners with Siemens’ Cre8Ventures EDA tool access programme. “The collaboration ...
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