Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

In the race to extend Moore’s Law through advanced packaging, the limits of precision are no longer defined solely by lithography. Increasingly, they are dictated by the unpredictable behavior of ...

Trends in next-generation battery packaging architectures. Optimizing packaging space with cell-connecting systems. Novel solutions for solving EMI, thermal management, and range-anxiety challenges.

A comprehensive assessment sought to evaluate the potential environmental impacts of replacing polyethylene, or PE, packaging like bags, films and containers with alternative materials, including ...