Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

You just built a breadboard of your expert design. You did all the simulations needed before going to layout, and reviewed the manufacturer's suggested techniques for a good thermal design for the ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

As the speeds of various SerDes interfaces move into the multi-gigabits/sec range, more ASIC chips are being designed to have multiple high speed interfaces such as USB 3.0, PCIE Gen3, DDR3, and ...

This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...

Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO). Photonic IC packaging ...

It’ll come as no surprise to any savvy buyer, and certainly not to any design engineer, that each new generation of electronic products packs more performance into a smaller package than the product ...