(Bloomberg) -- A secretive American startup has emerged with aspirations to challenge two titans of the semiconductor industry: ASML Holding NV and Taiwan Semiconductor Manufacturing Co. The company, ...

An extremely ambitious startup called Substrate Inc. said today it has raised an initial $100 million to fund its mission to disrupt the global semiconductor industry and reinvent chipmaking. The ...

Nippon Electric Glass Co. has embarked on developing an innovative glass core substrate compatible with CO2 laser processing, aiming to enhance the efficiency of manufacturing next-generation ...

Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...

A team led by researchers at Rensselaer Polytechnic Institute (RPI) has made a breakthrough in semiconductor development that could reshape the way we produce computer chips, optoelectronics and ...

Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential withdrawal amid ...

BOSTON, MA, UNITED STATES, February 18, 2025 /EINPresswire.com/ -- UniversityWafer, Inc., a global leader in advanced semiconductor substrates, is proud to announce ...

TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Absolics to build a semiconductor materials plant in Georgia. The company receives $75 million grant from U.S. Commerce Department. Feel unsure about the market’s next move? Copy trade alerts from ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.