In 1993 the average cell phone in Japan occupied 150 cubic centimeters and weighed 200 grams. Today, the corresponding figures are 84 cc and 99 grams. But the truly amazing part is all of the features ...
SAN MATEO, Calif. — Stacked-die packaging — in which IC dice are literally stacked one on top of the other, electrically connected and encapsulated — has taken root in the cell-phone handset market as ...
Intel Corp. said it has developed a method of stacking flash memory five dice high, as a way of increasing the memory found within cell phones and PDAs. Intel has developed a technology called ...
Research on 3D stacked IC (3D-SIC) technology has advanced to the point where most semiconductor companies have released or announced 3D-SIC products. These packages require multiple chip dies to be ...
AMD's Zen 2 and Zen 3 processor cores stack up pretty well against Intel's finest, largely thanks to the use of a secret weapon: massive last-level caches. The company's Radeon arm pulled the same ...
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