Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...

A high-speed parallel bus, such as a double data rate (DDR) memory interface, requires a different approach because the speeds are lower but the number of signals involved is much larger. The design ...

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its ...

Gold-on-gold stud-bumps comprise a connection technique used in some microminiature flip-chip assemblies: (a) shows bumps on an IC; (b) is a close-up view. Flip-chip processes allow miniaturization of ...

Compatible with semiconductor fabrication and processing technologies, thermoelectric thin-film materials allow the cooling function to be integrated within power-semiconductor devices. Dr. Paul A.